Electronic component including electronic substrate and circuit member, apparatus, and camera

ABSTRACT

An electronic component comprising: an electronic substrate that includes an electronic element and a first connection terminal a package member that is disposed on the electronic substrate; and a circuit member that includes a second connection terminal, wherein the circuit member is disposed between the package member and the electronic substrate, and extends from the position between the package member and the electronic substrate outward beyond the edge of the electronic substrate; the electronic component includes a connecting member that is disposed between the circuit member and the electronic substrate, and electrically connects the second connection terminal and the first connection terminal, an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; the connecting member, the circuit member, and the adhesive member are located between the package member and the electronic substrate.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to an electronic component including anelectronic substrate and a circuit member, an apparatus and a camera.

Description of the Related Art

An electronic component installed in an imaging apparatus, a displayapparatus and the like normally includes: an electronic substrate onwhich an electronic element is disposed; a circuit member that suppliespower to the electronic substrate from an external power supply; and apackage member that protects the electronic substrate and the circuitmember from moisture and dust.

The electronic substrate includes an element region where the electronicelement is formed, and a peripheral region which is created on the outeredge side of the element region. In the peripheral region, an externalconnection terminal is disposed so as to bond the circuit member, suchas a flexible printed circuit (FPC). The package member is disposed soas to enclose at least an element formed surface of the electronicsubstrate.

In order to decrease the size of an electronic substrate, minimizing thewidth of the peripheral region on the electronic substrate is demanded.To minimize the width of the peripheral region, the area of the externalconnection terminal may be decreased, but decreasing the bonding areabetween the external connection terminal and the circuit memberdecreases the bonding strength (reliability of the bonding).

In Japanese Patent Application Publication No. 2016-111676, on the otherhand, the side face of a package member 34 (frame) and a circuit member36 a (FPC leading portion) are joined by an adhesive member 37(reinforcing resin), as illustrated in FIG. 6. Thereby an improvement inthe reliability of the bonding between the electronic substrate 36 andthe circuit member 36 a (rigid flexible member) is attempted.

SUMMARY OF THE INVENTION

In the case of Japanese Patent Application Publication No.2016-111676,however, if a force that pulls the electronic substrate 36is applied in a direction vertical to the principal surface of thecircuit member 36 a, a shearing stress is applied to an adhesive member37 on the side face of the package member 34. As a result, the adhesivemember 37 is peeled off along the side face of the package member 34.

Furthermore, a gap 51 (air hole) is formed between the bonding portionof the electronic substrate 36 and the circuit member 36 a and thepackage member 34 without disposing the adhesive member 37. Therefore,if the circuit member 36 a is pulled in the vertical direction, theadhesive member 37 is deformed, and a force to lift the bonding portionin the vertical direction is activated, whereby the circuit member 36 ais easily peeled off

With the foregoing in view, it is an object of the present technique toprovide an electronic component which allows downsizing the electronicsubstrate while maintaining the reliability of the bonding between theelectronic substrate and the circuit member.

A first aspect of the technology of the present disclosure is:

-   -   an electronic component comprising:    -   an electronic substrate that includes an electronic element and        a first connection terminal;    -   a package member that is disposed on the electronic substrate;    -   a circuit member that includes a second connection terminal,        wherein the circuit member is disposed between the package        member and the electronic substrate, and the circuit member        extends from the position between the package member and the        electronic substrate outward beyond the edge of the electronic        substrate;    -   a connecting member that is disposed between the circuit member        and the electronic substrate, and electrically connects the        second connection terminal and the first connection terminal;    -   an adhesive member that is disposed between the circuit member        and the package member, and joins the circuit member to the        package member; and    -   a light-transmitting member that faces the electronic substrate        via a space, wherein    -   the connecting member, the circuit member, and the adhesive        member are located between the package member and the electronic        substrate,    -   the package member encloses the space, the package member has a        side face which faces the space, and    -   the adhesive member covers the side face of the package member.

A second aspect of the technology of the present disclosure is:

-   -   an electronic component comprising:    -   an electronic substrate that includes an electronic element and        a first connection terminal;    -   a package member that is disposed on the electronic substrate;    -   a circuit member that includes a second connection terminal,        wherein the circuit member is disposed between the package        member and the electronic substrate, and extends from the        position between the package member and the electronic substrate        outward beyond the edge of the electronic substrate;    -   a connecting member that is disposed between the circuit member        and the electronic substrate, and electrically connects the        second connection terminal and the first connection terminal;    -   an adhesive member that is disposed between the circuit member        and the package member, and joins the circuit member to the        package member; and    -   an opposing substrate that faces the electronic substrate,        wherein    -   the connecting member, the circuit member and the adhesive        member are located between the package member and the electronic        substrate;    -   the opposing substrate and the electronic substrate are bonded        together by a bonding member; and    -   the opposing substrate and the circuit member are joined        together by the adhesive member.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments with reference to theattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are diagrams illustrating an electronic componentaccording to Embodiment 1;

FIGS. 2A to 2D are diagrams illustrating manufacturing steps of theelectronic component according to Embodiment 1;

FIG. 3 is a flow chart illustrating a manufacturing method of theelectronic component according to Embodiment 1;

FIG. 4A is a diagram illustrating an electronic component according toEmbodiment 2;

FIG. 4B is a diagram illustrating an electronic component according toEmbodiment 3;

FIG. 4C a diagram illustrating an electronic component according toModification 1;

FIGS. 5A and 5B are diagrams illustrating an electronic componentaccording to Embodiment 4;

FIG. 6 is a diagram illustrating an electronic component according to aprior art; and

FIG. 7 is a diagram illustrating an apparatus (camera).

DESCRIPTION OF THE EMBODIMENTS

Preferred embodiment of the present technique will be described withreference to the accompany drawings. In each drawing, same members orsame composing elements are denoted with a same reference number, and inthe following embodiments, redundant description will be omitted.

Embodiment 1

An electronic component according to Embodiment 1 of the presenttechnique will be described with reference to FIGS. 1A and 1B. FIGS. 1Aand 1B are schematic cross-sectional views to explain the electroniccomponent of Embodiment 1.

General Configuration of Electronic Component

A general configuration of the electronic component of Embodiment 1 willbe described first with reference to FIGS. 1A and 1B. FIG. 1A is across-sectional view of the electronic component, and FIG. 1B is aperspective view when the electronic component is viewed in the arrow Xdirection (from the top) in FIG. 1A. The electronic component ofEmbodiment 1 includes an electronic substrate 100, a connecting member200, a circuit member 300, an adhesive member 400 and a package member500.

The electronic substrate 100 includes a substrate 10 (e.g. silicon,glass), an electronic element 20, and an external connection terminal30. On the first principal surface of the electronic substrate 100, anelement region, in which the electronic element 20 is disposed, and aperipheral region, which is outside the element region and in which theexternal connection terminal 30 is disposed, exist. In the elementregion, a plurality of electronic elements 20 may be arrayedtwo-dimensionally. Thereby the electronic substrate 100 constitutes anelectronic device. If the electronic element 20 is a display element(e.g. light-emitting element, liquid crystal element), the electronicdevice is the display device, and if the electronic element 20 is animage pickup element (e.g. photoelectric conversion element), theelectronic device is the image pickup element. The external connectionterminal 30 of the electronic substrate 100 and the circuit member 300are bonded together via the connecting member 200, and are electricallyconnected with each other. Specifically, the external connectionterminal 30 of the electronic substrate 100 and the connection terminalof the circuit member 300 are connected (bonded) together.

The connecting member 200 is disposed between the circuit member 300 andthe electronic substrate 100. The connecting member 200 is a bump, ananisotropic conductive film, an anisotropic conductive paste or thelike. In the case of using the bump for the connecting member 200, theexternal connection terminal 30 and the circuit member 300 areelectrically connected by an ultrasonic wave or press heating. In thecase of using an anisotropic conductive film or anisotropic conductivepaste, on the other hand, the external connection terminal 30 and thecircuit member 300 are electrically connected by heating and pressing.

The circuit member 300 is typically a printed circuit member, and is arigid member (e.g. glass epoxy member, composite member) on which awiring pattern is printed. The circuit member 300 may be a flexiblecircuit member (flexible printed circuit, which is a flexible film (e.g.polyimide) on which a wiring pattern is formed. Further, the circuitmember 300 may be a rigid flexible circuit member, which is a compositeof a flexible film and a rigid member. An electrode (connectionterminal) to electrically connect with the external connection terminal30 is formed on the surface of the circuit member 300 that is in contactwith the connecting member 200, and an insulating member is formed onthe surface of the circuit member 300 that is in contact with theadhesive member 400.

The circuit member 300 can supply power to the electronic substrate 100from the outside (external electrode) of the electronic substrate 100.The circuit member 300 can also input signals to the electronicsubstrate 100 or output signals from the electronic substrate 100 to theoutside. In other words, the circuit member 300 connects the electronicsubstrate 100 with the outside. The circuit member 300 is joined to thepackage member 500 by the adhesive member 400. Specifically, the portionof the second principal surface on the opposite side of the firstprincipal surface is joined to the package member 500 by the adhesivemember 400. On the portion of the first principal surface of the circuitmember 300 is disposed the connecting member 200. The circuit member 300extends from the position between the package member 500 and theelectronic substrate 100 outward beyond the edge of the electronicsubstrate 100.

The adhesive member 400 is disposed between the circuit member 300 andthe package member 500. The adhesive member 400 is made of such anadhesive material as a thermosetting resin, a two-liquid curing resin ora UV curing resin.

The package member 500 is disposed so as to enclose (cover) theelectronic substrate 100 on the outer periphery of the electronicsubstrate 100. The package member 500 is disposed to prevent the entryof moisture and dust to the element formed surface of the electronicsubstrate 100. Therefore, the package member 500 is disposed so as tocontact the first principal surface of the electronic substrate 100. Thepackage member 500 is made of polyphenylene ether (PPE), liquid crystalpolymer, polyamide or the like. In other words, the package member 500is made of a material having rigidity (rigid member).

As illustrated in FIG. 1B, when the electronic component is viewed inthe X direction, the connecting member 200 and the adhesive member 400are disposed between the side face 500 a on the outer side of thepackage member 500 and the side face 500 b on the inner side of thepackage member 500. The electronic component of Embodiment 1 has astructure where the electronic substrate 100, the connecting member 200,the circuit member 300, the adhesive member 400 and the package member500 are sequentially stacked without any gaps, in a portion where theconnecting member 200 is disposed. In Embodiment 1, the stackingdirection is a direction vertical to the first principal surface of thecircuit member 300. In other words, the connecting member 200, thecircuit member 300 and the adhesive member 400 are located between thepackage member 500 and the electronic substrate 100.

Manufacturing Method of Electronic Component

A manufacturing method of the electronic component according toEmbodiment 1 will be described next with reference to thecross-sectional views in FIGS. 2A to 2D illustrating the manufacturingsteps of the electronic components, and the flow chart in FIG. 3illustrating the manufacturing method.

S1002

First, as illustrated in FIG. 2A, the electronic element 20 and theexternal connection terminal 30 are disposed (formed) on the firstprincipal surface of the substrate 10 (e.g. silicon, glass). Theelectronic element 20 is not only a semiconductor element, such as atransistor, but may be a display element (e.g. liquid crystal element,organic EL element) or a piezoelectric element. The external connectionterminal 30 is made of metal material (e.g. aluminum, copper), and apattern is formed using a known semiconductor technique, such asphoto-etching and dual damascene. By this step, the electronic substrate100 is formed. It is not always necessary to form the electronicsubstrate 100 in S1001, and an electronic substrate 100, which isgenerated in advance, may be prepared (provided), for example.

S1002

Then, as illustrated in FIG. 2B, the external connection terminal 30 ofthe electronic substrate 100 is bonded (connected) to the connectionterminal of the circuit member 300 via the connecting member 200. InEmbodiment 1, the flexible printed circuit is used for the circuitmember 300, and the anisotropic conductive film is used for theconnecting member 200, and the external connection terminal 30 is bondedto the circuit member 300 by thermo-compression bonding. In order toincrease adhesive strength (reliability of the bonding), the electronicsubstrate 100 and the circuit member 300 may be joined together using areinforcing adhesive (reinforcing resin; resin member), which isdifferent from the adhesive member 400, so as to stretch from the frontsurface and the rear surface of the circuit member 300 to the electronicsubstrate 100. For the reinforcing adhesive, any adhesive material andcuring method may be used.

S1003

Then, as illustrated in FIG. 2C, the adhesive member 400 is formed bycoating, between the bonding surface (first principal surface) of thecircuit member 300 with the connecting member 200 and the oppositesurface thereof (second principal surface). For the adhesive member 400,any adhesive material can be used, and in Embodiment 1,a thermosettingepoxy resin is used.

S1004

Then, as illustrated in FIG. 2D, the package member 500 is mounted so asto cover (contact) the circuit member 300, on which the adhesive member400 is formed, and the electronic substrate 100. Then the adhesivemember 400 is cured, and the second principal surface of the circuitmember 300 and the package member 500 are joined together. Here, thecircuit member 300 is joined so as to extend from the position betweenthe package member 500 and the electronic substrate 100 outward beyondthe edge of the electronic substrate 100. In Embodiment 1, the adhesivemember 400 is cured by heating at 120° C. for 60 minutes using an oven.In S1004, the electronic substrate 100, the connecting member 200, thecircuit member 300, the adhesive member 400 and the package member 500are stacked without any gaps in the stacking direction in the portionwhere the connecting member 200 is disposed. In other words, theconnecting member 200, the circuit member 300 and the adhesive member400 are joined together so as to be located between the package member500 and the electronic substrate 100. Thereby the electronic componentaccording to Embodiment 1 is completed.

Effect

As described above, in the electronic component according to Embodiment1, the circuit member 300 and the package member 500 are joined togetherby the adhesive member 400, hence the adhesive strength to the forceapplied to the circuit member 300 in the horizontal direction (directionparallel with the first principal surface of the electrode substrate)improves. Further, the electronic substrate 100, the connecting member200, the circuit member 300, the adhesive member 400 and the packagemember 500 are stacked without any gaps in the stacking direction. Thismeans that the electronic component has a structure where the bondingportion between the electronic substrate 100 and the circuit member 300is pressed down by the adhesive member 400 and the package member 500.Therefore, the adhesive strength (bonding strength), in the case whereforce is applied to the circuit member 300 in the stacking direction,improves.

By this configuration of the electronic component, reliability of thebonding between the circuit member 300 and the electronic substrate 100improves, which makes it possible to further decrease the width of theexternal connection terminal 30. As a consequence, downsizing of theelectronic substrate 100 can be implemented while maintainingreliability of the bonding between the circuit member 300 and theelectronic substrate 100.

Embodiment 2

An electronic component according to Embodiment 2 will be described withreference to FIG. 4A. FIG. 4A is a schematic cross-sectional viewexplain the electronic component according to Embodiment 2.

Unlike Embodiment 1, in the electronic component according to Embodiment2, the adhesive member 400 disposed on the circuit member 300 extends soas to cover the side face 500 a on the outer side and the side face 500b on the inner side of the package member 500. In other words, a part ofthe package member 500 is embedded in the adhesive member 400. Since theadhesive member 400 is disposed on the side face 500 b on the inner sideof the package member 500 as well, the adhesive strength to the force ofpulling the circuit member 300 in the horizontal direction can beimproved.

The electronic component of Embodiment 2 can be manufactured by the samemanufacturing method as Embodiment 1, but the coating amount of theadhesive member 400 must be slightly more since the adhesive member 400extends to the side faces of the package member 500 in S1003. Further,when the package member 500 is mounted on the electronic substrate 100in S1004, it is preferable that the force pressing down is stronger thanthe case of Embodiment 1.

According to the electronic component of Embodiment 2, the adhesivestrength (bonding strength) to the force applied to the circuit member300 in the horizontal direction can be improved even more thanEmbodiment 1. Since the width of the external connection terminal 30 canbe decreased even more, a further downsizing of the electronic substrate100 can be implemented.

Embodiment 3

An electronic component according to Embodiment 3 will be described withreference to FIG. 4B. FIG. 4B is a schematic cross-sectional view toexplain the electronic component according to Embodiment 3.

Unlike Embodiment 1, in the electronic component according to Embodiment3, a light-transmitting type opposing substrate 700 is disposed so as tooppose the first principal surface of the electronic substrate 100 via aspace, as illustrated in FIG. 4B, and the adhesive member 400 extends tothe opposing substrate 700. Further, a light-transmitting member 800 isdisposed so as to oppose the first principal surface of the electronicsubstrate 100 and be enclosed by the package member 500. The packagemember 500 may be regarded as a package member in the narrow sense. Anda member combining the opposite substrate 700 and the package member500, or a member combining the light-transmitting member 800 and thepackage member 500, may be regarded as a package member in the broadsense. In other words, a member enclosing the space that exists on thefirst principal surface of the electronic substrate 100 may be regardedas the package member.

In Embodiment 3, the electronic element 20 is a display element such asa liquid crystal element, and an organic EL element, or an image pickupelement such as a photoelectric conversion element. The photoelectricconversion element may have, for example, a photodiode structure, aphoto-gate structure, or a structure including a photoelectric convertorand an electrode pair sandwiching the photoelectric convertor. Theelectronic element 20 includes a transistor to drive the display elementor the photoelectric conversion element. The external connectionterminal 30 is formed by the same method as Embodiment 1.

The opposing substrate 700 is joined (bonded) to the electronicsubstrate 100 via the bonding member 600, which is an adhesive to join(bond) the two substrates together. The material of the opposingsubstrate 700 is not especially limited as long as it is alight-transmitting material, and may be glass and acrylic plating. It ispreferable that the opposing substrate 700 made of a material havingrigidity (rigid member). In Embodiment 3, the bonding member 600 isformed only in the region where the electronic element 20 is not formed,but the bonding member 600 may be formed so as to cover the region wherethe electronic element 20 is formed. For the bonding member 600, anyadhesive may be used, but a UV curable resin is preferable.

The opposing substrate 700 is also joined to the circuit member 300 viathe adhesive member 400. This means that the adhesive member 400 isformed so as to contact both the package member 500 and the opposingsubstrate 700. The adhesive member 400 covers the side face (inner sidesurface) of the package member 500 facing the space between theelectronic substrate 100 and the opposing substrate 700. The adhesivemember 400 is coated on the circuit member 300, and the adhesive member400 can be formed so as to extend to the opposing substrate 700utilizing the protrusion of the adhesive member 400 in the horizontaldirection caused by pressing the package member 500 down.

The light-transmitting member 800 is disposed so as to oppose the firstprincipal surface of the electronic substrate 100, and is disposed inthe opening of the package member 500. The light-transmitting member 800may be installed after mounting the package member 500 on the electronicsubstrate 100, or the package member 500 may be mounted on theelectronic substrate 100 after the light-transmitting member 800 isinstalled in the package member 500. The material of thelight-transmitting member 800 is not especially limited as long as it isa light-transmitting material, and may be glass and acrylic plating.

In the electronic component of Embodiment 3, the adhesive member 400 isjoined not only to the package member 500, but also to the opposingsubstrate 700. Therefore, the adhesive strength (bonding strength) tothe force of pulling the circuit member 300 in the horizontal direction,and the adhesive strength to the force of pulling the circuit member 300in the stacking direction, can be further improved. As a result, thewidth of the external connection terminal 30 can be further decreased,and a further downsizing of the electronic substrate 100 can beimplemented.

Modification 1

An electronic component according to Modification 1 of Embodiment 3 willbe described with reference to FIG. 4C. As illustrated in FIG. 4C, inthe electronic component, the circuit member 300 is disposed between theelectronic substrate 100 and the opposing substrate 700, and the circuitmember 300 and the opposing substrate 700 are joined together by theadhesive member 400. Specifically, the portion of the second principalsurface of the circuit member 300, which is on the opposite side of theportion of the first principal surface where the connecting member 200is disposed, is joined to the opposing substrate 700. In other words, inModification 1, the electronic substrate 100, the connecting member 200,the circuit member 300, the adhesive member 400 and the opposingsubstrate 700 are sequentially stacked in the stacking direction withoutany gaps, in the portion where the connecting member 200 is disposed.The connecting member 200, the circuit member 300 and the adhesivemember 400 are disposed between the opposing substrate 700 and theelectronic substrate 100. The circuit member 300 extends from theposition between the opposing substrate 700 and the electronic substrate100 outward beyond the edge of the electronic substrate 100.

In Modification 1, the electronic component has a structure where theopposing substrate 700 made of rigid material and the circuit member 300are joined together by the adhesive member 400, so that the opposingsubstrate 700 is further stacked in the bonding portion between theelectronic substrate 100 and the circuit member 300. The opposingsubstrate 700 is joined to the electronic substrate 100 by the bondingmember 600, hence the circuit member 300 does not easily move in thestacking direction. Since the opposing substrate 700 plays the samefunction as the package member 500 in other embodiments, the structureof the electronic component of Modification 1 is regarded as having thesame structure as other embodiments, and can implement the same effectas the other embodiments.

By Modification 1 as well, the adhesive strength (bonding strength) tothe force of pulling the circuit member 300 in the horizontal directionand the stacking direction can be improved. As a result, the width ofthe external connection terminal 30 can be further decreased, and afurther downsizing of the electronic substrate 100 can be improved.

Embodiment 4

An electronic component according to Embodiment 4 of the presenttechnique will be described with reference to FIGS. 5A and 5B. FIG. 5Ais a schematic cross-sectional view to explain the electronic componentaccording to Embodiment 4. FIG. 5B is a schematic cross-sectional viewwhen the electronic component is viewed in the arrow Y direction (sideface direction) in FIG. 5A. In Embodiment 4, the electronic element 20is an organic EL element.

Unlike Embodiment 3, the bonding member 600 is formed so as to fill(bond) the space between the electronic substrate 100 and the opposingsubstrate 700 throughout the region where the electronic element 20 isformed. Further, the adhesive member 400 contacts the side face of thebonding member 600.

Furthermore, as illustrated in FIG. 5B, the adhesive member 400 contactsnot only the side of the bonding member 600 on the circuit member 300side, but encloses the bonding member 600 so that the bonding member 600is not exposed to air. In the case of the electronic apparatusillustrated in FIG. 5B, the bonding member 600 is not enclosed by theadhesive member 400 on the side where the package member 500 and theopposing substrate 700 are in contact with each other. In other words,the bonding member 600 is enclosed by the adhesive member 400 in theportion where the bonding member 600 is exposed. However, the presentinvention is not limited to this, and the bonding member 600 may becompletely enclosed by the adhesive member 400.

If there is a space between the electronic substrate 100 and theopposing substrate 700, a part of the light-emitting components from theelectronic element 20 (organic EL element) is reflected or refracted atthe interface between the electronic substrate and air, which drops thelight extraction efficiency. By disposing the bonding member 600throughout the region where the electronic element 20 is formed, as inEmbodiment 4, the light extraction efficiency can be improved.

High light-transmitting performance is demanded for the bonding member600, but at the same time, it is preferable that the bonding member 600has moisture resistance in order to protect the electronic element 20.However, the electronic element 20, which is an organic EL element, iseasily affected by moisture and heat, and the bonding member 600 must beformed by low temperature curing (100° C. or less). Because of thisprocessing restriction, it is difficult for the bonding member 600 to behighly moisture resistance.

Therefore the infiltration of moisture to the bonding member 600 isprevented by disposing the adhesive member 400, which has highlymoisture resistance, so as to contact the side face of the bondingmember 600. For the adhesive member 400, which is not required to havehigh light transmittance, any material having highly moisture resistancecan be used.

In Embodiment 4, the adhesive member 400 is coated on the circuit member300, and the adhesive member 400 is also coated on the electronicsubstrate 100 near the portion where the bonding member 600 is exposed.After the package member 500 is mounted on the adhesive member 400, theadhesive member 400 is cured, whereby manufacture of the electroniccomponent completes.

For the adhesive member 400, any one of two-liquid curing resin, UVcuring resin and thermosetting resin may be used. However, in the caseof the light-shielding type package member 500, which makes it difficultto sufficiently UV-cure the adhesive member 400, the adhesive member 400must be cured at low temperature, considering the heat resistance of theorganic EL element. Therefore, it is preferable to use the two-liquidcuring resin for the adhesive member 400. In Embodiment 4, two-liquidcuring epoxy resin is used.

According to Embodiment 4, the adhesive member 400, which has highermoisture resistance than the bonding member 600, is formed so as toenclose the bonding member 600, whereby the bonding member 600 can beselected considering only the light transmittance and processrestrictions. Hence a bonding member 600 which has higher lighttransmittance or which can be more easily formed can be selected.Further, moisture infiltration into the electronic element 20 can beprevented by the adhesive member 400, therefore an electronic componenthaving an even higher reliability can be implemented.

The present technique can be applied to an apparatus that includes anyone of the electronic components of the above mentioned embodiments. Theapparatuses to which the present technique can be applied are, forexample, a smartphone, a camera, a personal computer and otherelectronic information apparatuses (electronic apparatuses, informationapparatuses). The present technique can also be applied to, for example,a communication apparatus to perform wireless communication, an officeapparatus such as a copier and scanner, and a transport apparatus usedfor automobiles, ships and airplanes. The present technique can also beapplied to, for example, an industrial apparatus (e.g. robot), ananalytical apparatus using energy rays (lights, electrons, radio waves),and a medical apparatus (e.g. endoscope, radiology equipment). In anapparatus to which the present technique is applied, the circuit memberof the electronic component of the above mentioned embodiments isconnected to another component included in the apparatus. The functionsof other components to which the circuit member of the electroniccomponent is connected can be set according to the functions of theelectronic component, which are, for example, a function to control ordrive the electronic component, or a function to process a signal forcommunicating with the electronic component. Using the electroniccomponent of Embodiment 4 in apparatuses is advantageous to improvedurability of the reliability of the apparatuses, as well as indownsizing the apparatuses.

FIG. 7 is a diagram illustrating a camera CMR, which is an example of anapparatus to which the present technique is applied. The camera CMR mayhave an electronic component EC1 which includes an image sensor IS and aflexible printed circuit FPC1. The camera CMR may have an electroniccomponent EC2 which includes a display DP and a flexible printed circuitFPC2. The camera CMR may have another component EC3 to which theflexible printed circuit FPC1 and/or the flexible printed circuit FPC2are/is connected. The camera CMR may have a lens LNS which is detachablefrom the camera body, or a lens LNS which is fixed to the camera body.Any one of the electronic components of the above mentioned embodimentsmay be either the electronic component EC1 or the electronic componentEC2. The image sensor IS includes the electronic substrate 100 includingthe photoelectric conversion element (electronic element 20), and theflexible printed circuit FPC1 corresponds to the circuit member 300. Thedisplay DP includes the electronic substrate 100 which has a displayelement (electronic element 20), and the flexible printed circuit FPC2corresponds to the circuit member 300. The electronic substrate 100 ofthe electronic component EC2 may constitute an electronic view finder(EVF).

According to this technique, in the electronic component, the electronicsubstrate can be downsized while maintaining reliability of the bondingbetween the electronic substrate and the circuit member.

Each term in this description is merely to describe the presenttechnique, and may include equivalents thereof, therefore the presenttechnique is not limited by a close reading of a term. The aboveembodiments are merely examples of how to carry out the presenttechnique, and therefore the technical scope of the present technique isnot limited by these embodiments. In other words, the disclosure of thepresent technique can be implemented in various ways without departingfrom the technical concept or major features thereof

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

This application claims the benefit of Japanese Patent Application No.2019-048543, filed on Mar. 15, 2019, which is hereby incorporated byreference herein in its entirety.

What is claimed is:
 1. An electronic component comprising: an electronicsubstrate that includes an electronic element and a first connectionterminal; a package member that is disposed on the electronic substrate;a circuit member that includes a second connection terminal, wherein thecircuit member is disposed between the package member and the electronicsubstrate, and the circuit member extends from the position between thepackage member and the electronic substrate outward beyond the edge ofthe electronic substrate; a connecting member that is disposed betweenthe circuit member and the electronic substrate, and electricallyconnects the second connection terminal and the first connectionterminal; an adhesive member that is disposed between the circuit memberand the package member, and joins the circuit member to the packagemember; and a light-transmitting member that faces the electronicsubstrate via a space, wherein the connecting member, the circuitmember, and the adhesive member are located between the package memberand the electronic substrate, the package member encloses the space, thepackage member has a side face which faces the space, and the adhesivemember covers the side face of the package member.
 2. The electroniccomponent according to claim 1, wherein the connecting member is ananisotropic conductive film.
 3. The electronic component according toclaim 1, wherein the circuit member is a flexible printed circuit. 4.The electronic component according to claim 1, wherein the adhesivemember is a thermosetting epoxy resin.
 5. The electronic componentaccording to claim 1, wherein the adhesive member is a two-componentcurable epoxy resin.
 6. The electronic component according to claim 1,wherein the electronic substrate and the circuit member are joinedtogether by a resin member that is different from the adhesive member.7. The electronic component according to claim 1, further comprising: anopposing substrate that faces the electronic substrate, wherein theopposing substrate and the electronic substrate are bonded together by abonding member, and the opposing substrate and the circuit member arejoined together by the adhesive member.
 8. The electronic componentaccording to claim 7, wherein the bonding member is enclosed by theadhesive member.
 9. The electronic component according to claim 7,wherein the adhesive member has a higher moisture resistance than thebonding member has.
 10. The electronic component according to claim 7,wherein the bonding member is a UV-cured resin.
 11. The electroniccomponent according to claim 1, wherein the electronic element is anorganic EL element.
 12. The electronic component according to claim 1,wherein the electronic element is a photoelectric conversion element.13. An apparatus comprising: the electronic component according to claim1; and a component connected to the circuit member.
 14. A cameracomprising: the electronic component according to claim 1; and acomponent connected to the circuit member, wherein the electronicsubstrate constitutes an electronic view finder.
 15. An electroniccomponent comprising: an electronic substrate that includes anelectronic element and a first connection terminal; a package memberthat is disposed on the electronic substrate; a circuit member thatincludes a second connection terminal, wherein the circuit member isdisposed between the package member and the electronic substrate, andextends from the position between the package member and the electronicsubstrate outward beyond the edge of the electronic substrate; aconnecting member that is disposed between the circuit member and theelectronic substrate, and electrically connects the second connectionterminal and the first connection terminal; an adhesive member that isdisposed between the circuit member and the package member, and joinsthe circuit member to the package member; and an opposing substrate thatfaces the electronic substrate, wherein the connecting member, thecircuit member and the adhesive member are located between the packagemember and the electronic substrate; the opposing substrate and theelectronic substrate are bonded together by a bonding member; and theopposing substrate and the circuit member are joined together by theadhesive member.
 16. The electronic component according to claim 15further comprising a light-transmitting member that faces the electronicsubstrate via a space, wherein the package member encloses the space.17. The electronic component according to claim 16, wherein the packagemember has a side face which faces the space, and the adhesive membercovers the side face of the package member.